Aug
25

Forbes Cites Melexis Among Most Trustworthy Companies in Western Europe

 

Melexis, a global microelectronics engineering company, has been included in Forbes magazine’s 50 Most Trustworthy Companies in Western Europe, for having consistently demonstrated transparent accounting procedures and solid corporate governance. Other companies to be included in this list were French retailer FNAC, UK industrial machinery manufacturer Renishaw, Swedish hardware chain Clas Ohlson and German clothing brand Hugo Boss.

 

In order to co

mpile the list, Forbes worked with leading investment advisor MSCI. More than 1,100 publicly-traded non-financial European companies with market capitalization figures of $500 million or above were screened, covering a multitude of different industry sectors. After detailed analysis and extensive deliberation, the 50 companies that proved most deserving of inclusion were confirmed.  

 

“Melexis upholds strong core values that have allowed us to successfully grow commercially while maintaining the highest degrees of integrity,” stated Françoise Chombar, CEO at Melexis. “It is a great honor to be recognized by a globally-respected organization like Forbes for the professionalism of our business practices. This reflects on the whole company, from the vision of executive leadership right through to the efforts of every individual team member. It is a testament to the positive, highly-motivated working culture we have established over the last 27 years.” 

Aug
24

SEGGER Announces J-Link Firmware Upgrade for BBC micro:bit

SEGGER has introduced J-Link support for the BBC micro:bit providing students a path to using a production grade IDE for their next micro:bit project.

SEGGER offers the capability to upgrade the firmware on the BBC micro:bit DAPLink to a J-Link OB (On Board). This firmware makes the on-board debug solution on the BBC micro:bit compatible to J-Link, allowing users to take advantage of all J-Link features such as ultra fast flash download and debugging speeds and the free-to-use GDBServer as well as application development using an IDE.

“Adding J-Link debug capabilities to the BBC micro:bit broadens its exposure to an even larger audience. The micro:bit eco-system is improved significantly by making professional tool options available to developers,” says John Leonard, Product Marketing Manager, Nordic Semiconductor.

J-Link is supported in all major IDE’s; IAR EWARM, Keil MDK, Rowley Crossworks, SEGGER’s own Embedded Studio and other Eclipse/GDB based offerings. This gives students developers flexibility in their choice of IDE’s without compromising on the superior download speed to RAM and Flash that J-Link technology offers.

To access more information on J-Link OB for BBC micro:bit go to: https://segger.com/jlink-bbc-micro-bit.html

Aug
12

SEGGER Introduces Customizable Flash Loaders for J-Link, J-Trace & Flasher Product Offerings

SEGGER has now added Open Flash Loader capabilities to its popular J-Link, J-Trace and Flasher offerings. This will provide both silicon vendors and end users with the flexibility they need to take advantage of the enhanced features incorporated into the company’s J-Link debug probe solutions by adding support for new target devices.

 

These target devices can be used in the same way as the target devices already fully supported by SEGGER, with direct flash download functionality in all related IDEs and debuggers – including GDB-based tool chains, such as Eclipse. For target devices implemented with the Open Flash Loader the capability to add an unlimited number of breakpoints in flash memory is also available.

 

For silicon vendors, this will mean they are able to implement support for new devices at the early stages of the development process, even before first silicon samples have been fabricated. Likewise, it will prove of great value in scenarios where the flash programming algorithm utilized must be kept confidential.

 

There is considerable potential for end users to benefit significantly too – particularly in cases where flash loaders will be working in conjunction with special external memories. One example of this would be (Q)SPI flash memories connected in a non-standard way (such as using alternate pin muxing). In addition to flash loaders created for J-Link, the Open Flash Loader can also utilize any CMSIS-compliant flash loader.

 

To access more information on the Open Flash Loader go to: http://www.segger.com/jlink-open-flashloader.html

Aug
02

Solid State Supplies & KEMET Sign UK/Ireland Supply Chain Agreement

Solid State Supplies Ltd has announced the forging of a non-exclusive distribution agreement with KEMET Electronics Corporation. The agreement, which will encompass both the UK and Ireland, means that Solid State Supplies will be able to provide KEMET products to its customer base, along with the high level of design and engineering support that it has become renowned for.

 

Through its well-established sales network, Solid State Supplies will use KEMET devices to address the commercial, technical and logistical demands of the computing, telecommunication, automotive, avionics, defence, medical and consumer sectors. This new distributorship seamlessly complements its existing analogue, digital, networking and power IC product lines.

 

KEMET is recognised as a leading global manufacturer of electronic components that meet the highest standards for quality, delivery and service. The company offers the broadest selection of capacitor technologies in the industry across all dielectrics. Its expansive range of tantalum and ceramic devices can be supplied in surface-mount or through-hole packaging formats, with automotive, military and space grade options. Likewise, KEMET’s polymer capacitors can be specified for high humidity or high temperature operation if required. In addition, the company provides electromechanical devices, electromagnetic compatibility solutions and supercapacitors.

 

“KEMET’s products add a further dimension to our overall offering, allowing us to present customers with a more complete solution for all of their needs, whether this is in relation to the wireless, embedded, memory or power arenas. We specialise in helping engineering teams to overcome their design challenges by supplying superior products combined with expert application knowledge,” commented Hugh Wratten, Product Manager for Solid State Supplies.

 

“KEMET is very pleased to be starting this collaboration with Solid State Supplies,” added Michael Nokes, UK & Ireland Account Manager for KEMET. “We believe that the company will bring a wealth of design experience that is certain to further enhance our ability to grow market share in this region.”

Aug
02

Melexis to Set Up Dresden R&D Center

 Melexis, a global microelectronics engineering company, has taken steps to further expand its operations, with the announcement that it is establishing a new R&D center. This latest Melexis site, which will initially have a complement of around 25 to 30 engineers, is going to be situated in Dresden, Germany. This will allow the company to tap into the wealth of semiconductor engineering talent to be found within the Saxony region.

 

Melexis already has 9 R&D centers located across the globe – Tessenderlo and Ieper (Belgium), Sofia (Bulgaria), Paris (France), Erfurt (Germany), Manila (the Philippines), Bevaix (Switzerland),  Kiev (Ukraine) and Nashua (New Hampshire, USA). These facilities support the company in creating advanced semiconductor technology to address the rapidly evolving automotive, industrial, medical, smart domestic appliance and building automation sectors. The core competence of the new design center in Dresden will be focusing on the automotive industry.

 

Marc Biron, Global Development Manager for Melexis stated: “After careful consideration we decided that Dresden presented us with a great opportunity to strengthen our engineering assets. We identified this as a highly conducive environment in which to place a new R&D center. As well as facilitating the recruitment of experienced technically astute staff, it will also enable us to benefit from the city’s formidable academic reputation.”

 

To find out more about the opportunities at Melexis’ new Dresden R&D centre click here https://melexis.csod.com/ats/careersite/search.aspx?site=2&c=melexis

 

Jul
28

Innovative Design Improves Field Serviceability of Mobile Hydraulic Position Sensors

 

 

 

MTS Sensors has expanded its widely used MH Series of magnetostrictive linear position sensors by introducing the field-serviceable Flexible MH (FMH). Designed for use with hydraulic cylinders in mobile applications, the externally threaded FMH sensor features an innovative two-part design. This design allows users to separate the flexible sensing element and electronics from the housing without opening the hydraulic system.

 

“While it is manageable to install and remove hydraulic cylinder sensors at a manufacturing facility, it can be extremely challenging in the field. This sensor addresses that challenge. Trained service technicians can remove and replace the internal components with just 200mm of clearance, regardless of stroke length and without breaking the hydraulic seal. This serviceability means decreased downtime and disruption, providing increased productivity,” states Luka Korzeniowski, MTS Sensors’ Global Market Segment Leader for Mobile Hydraulics.

 

The FMH uses MTS Sensors’ proprietary Temposonics® magnetostrictive technology to deliver high performance operation, with a ±0.2mm typical resolution, repeatability of ±0.005% (full scale) and a ±0.04% linearity (full scale). Available with Analog or CANbus output options, the FMH supports stroke lengths of 500mm to 5000mm. Replacement units ship as coiled rings to ease handling and reduce shipping costs.

Jul
26

First Winners Announced for X-FAB’s First-Time-Right & X-Cite Awards

X-FAB Silicon has confirmed the first winners of its annual First-Time-Right Award as well as its semi-annual X-Cite Award.

iC-Haus GmbH and New Japan Radio each won the First-Time-Right award for mastering significant implementation challenges in developing analog and mixed-signal ICs that fulfill the target specification at first design iteration. Fabless semiconductor company MinDCet NV won the X-Cite Award for stretching the performance envelope in X-FAB’s varied semiconductor processes.

iC-Haus GmbH is a leading independent German manufacturer of standard ICs (ASSP) and customized ASIC semiconductor solutions, headquartered in Bodenheim, Germany. New Japan Radio is an analog semiconductor IC design and manufacturing company headquartered in Tokyo, Japan.

X-FAB CEO Rudi De Winter presented the First-Time-Right Award to the CEOs of iC-Haus and New Japan Radio saying, “The devices New Japan Radio and iC-Haus developed have different characteristics, so the design engineers had very different challenges to master. I congratulate both companies on their achievements and wish them commercial success with their new products.”

X-FAB developed its X-Cite award to recognize fabless semiconductor companies and research establishments experienced in IC development for their innovation in extending the performance of X-FAB’s various semiconductor processes. MinDCet, the first winner of the X-Cite Award, designs and produces custom power management ASICs for high-voltage, high-temperature and high-frequency applications. The company is headquartered in Leuven, Belgium.

Dr. Ulrich Bretthauer, Business Line Manager Industrial & Medical at X-FAB, presented the X-Cite Award to MinDCet CEO Mike Wens, saying: “We know MinDCet for driving our technologies to the edge, but with this proposal you aim for even more ambitious targets, beyond what we envisioned when developing our SOI technology.”

 

Jul
25

Solid State Supplies Brings Low Power, Secure & Robust Solutions from Microsemi to UK Customer Base

Solid State Supplies Ltd has positioned itself as the prominent source in the UK for the latest technology from Microsemi, as the semiconductor manufacturer further strengthens its supply chain by closer cooperation with key channel partners. This highly focussed approach will mean that the UK market is served more effectively.

 

Not only does Solid States Supplies offer an expansive range of products, it also provides the application knowledge and engineering support OEM engineering teams need to expedite their development projects. The company has a large, dedicated staff of FAEs that are able to give hands-on advice. In addition, it holds free seminars/training days on a regular basis to help engineers gain greater expertise when implementing systems using Microsemi hardware. Here are just a few examples of the products available:

 

Low-Power FPGAs – With up to 150k of logic elements, the devices in the IGLOO 2 family of Flash-based FPGAs are highly suited to applications where energy efficient operation is a priority. Through their power-optimized architecture they are able to deliver superior performance levels while drawing only minimal current. Each device integrates a broad array of I/Os, plus sophisticated security functions and a large memory resource. They offer 3x lower static power and 25% lower total power consumption figures than competing devices without any compromise on functionality.

 

Hi-Rel Products – In order to address safety-critical and mission-critical applications, the portfolio of Microsemi products available via Solid State Supplies has an extensive selection of discrete devices (diodes, transistors, MOSFETs, IGBTs, etc.) capable of dealing with even the most demanding of environments. The devices supplied are resilient to shock/vibration, support greatly elevated temperature ranges and are radiation-tolerant or radiation-hardened. A choice quality screening options offered, as well as compliancy with military standards (MIL-PRF-19500, MIL-PRF-38534, etc.). Solid State Supplies is fully AS9120A certified and has decades of experience when it comes to dealing with difficult design challenges in the avionics, defence, oil/gas and heavy industrial sectors, amongst others.

 

SoC FPGA Design Security Platform – The SmartFusion2 Security Evaluation Kit facilitates the development of secure embedded systems. The SmartFusion2 SoC FPGA device at the heart of each of these kits has an ultra-reliable Flash-based FPGA fabric, with a 166MHz ARM Cortex-M3 embedded processor and highly advanced security processing accelerators. Among the data and IP security features incorporated are elliptic curve cryptography (ECC), SRAM physically un-clonable mechanism, random number generator (RNG), anti-tamper protection, AES/SHA encryption algorithms, etc.

For more details visit: www.sssltd.com

Jul
20

Renesas Electronics Europe and SEGGER Collaboration Accelerates Expansion of RX Ecosystem

Renesas Electronics Europe and SEGGER today announced their collaboration to facilitate expansion of the ecosystem of Renesas’ RX Family of 32-bit microcontroller units (MCUs) through adoption of SEGGER’s newly-released SystemView software. Forthwith SystemView will support streaming over J-Link, as well as real-time analysis and visualization, in relation to any Renesas RX-based embedded design.

 

SEGGER’s new SystemView solution gives complete insight into the behavior of a program, with minimal side effects on the embedded system being observed. It offers cycle accurate tracing of interrupts and task start/stop, plus task activation and API calls when an RTOS is used. It visualizes and analyzes CPU load by task, interrupts and software timers. By using SEGGER’s J-Link debug probe with SystemView streaming data transfer can be benefited from – with analysis in real-time. This enables an in-depth understanding of the application’s runtime behavior to be derived. Real-time analysis is particularly advantageous when dealing with complex systems consisting of multiple threads and events, and also in bare-metal systems without any RTOS.

 

Renesas’ RX Family of 32-bit MCUs are built around Renesas’ proprietary RXv1/RXv2 CPU core and combine excellent operation performance with superior power efficiency. The RX Family consists of four product series: the flagship RX700 series, with the fastest performance and most advanced functions; the standard RX600 series; the RX200 series, which delivers an optimal balance of power efficiency and high performance; and the entry-level RX100 series, with extremely low power consumption. These four series encompass a range of products for solutions within fields such as industry automation, security, home appliance, healthcare and human interface that provide seamless scalability from small-scale to large-scale applications.

 

“With the addition of SystemView to the RX ecosystem, our customers will have access to a higher degree of development support”, said Mohammed Dogar, Senior Manager for MCU/MPU Solution Marketing, Industrial & Communications Business Group, at Renesas Electronics Europe. ”SystemView demonstrates the power and efficiency of modern debug tools, where the latest technology ensures an efficient embedded design process. With SEGGER’s support, we can now offer an expanded ecosystem to our customers using the powerful and scalable RX microcontroller family.”

 

“As a Renesas Global Platinum Partner, we are proud to be able to help showcase the efficiency of the RX Family. Complementing the RX ecosystem with SystemView will open up modern debug functionality to developers using these MCUs in their designs,” said Dirk Akemann, Partnership Marketing Manager, SEGGER.

 

In order to ensure real-time delivery of data and minimal intrusiveness on the system – that means less than 1 µs overhead per call on a 200 MHz Renesas RX MCU – SystemView makes use of SEGGER’s unique Real-Time Transfer (RTT) technology. RTT enables up to 2 Mbyte per second data transfer for continuous acquisition of real-time data, requiring no hardware other than a J-Link and the standard debug interface. SystemView records the data retrieved from the target and visualizes the results in different ways. Data recordings can also be saved for later documentation and analysis. Evaluating a system in this manner expedites the finding and eliminating of problems, as well as allowing greater optimizing of the system. It is an essential part of quality management in any professional software development. SystemView interacts seamlessly with SEGGER’s RTOS embOS, which features all the recording capabilities needed. SystemView’s operation does not require any OS involvement.

 

For further information on SystemView and the functionality of the different modules in the package as well as download, please visit https://www.segger.com/systemview.html

 

Full J-Link product specifications are available at: www.segger.com/jlink.html

Jul
13

Melexis Leads New Wave of TPMS Innovation with World’s Smallest & Lowest Power Sensor Device

Melexis, a global microelectronics engineering company, continues to make major advances in tire pressure monitoring system (TPMS) technology with the introduction of its 3rd generation TPMS IC – the MLX91804.

Supplied in a robust 14-pin DFN type lead-less package, this product has a 60% smaller footprint and draws 3 times lower sleep mode current than any competing TPMS IC on the market. It incorporates a sophisticated microcontroller and MEMS-based pressure sensing element, as well as energy efficient 315/433MHz wireless transmitter (supporting data rates up to 150kbits/s) and 125kHz receiver for communication with the vehicle’s relevant electronic control unit (ECU). A 16kB embedded program memory is included for the storing of custom application data/libraries. In addition, there is a built-in single or dual axis high-g range accelerometer to support all market available wheel sensor auto-location functionalities.

The combination of minimal footprint and high degrees of integration offered by the MLX91804 means that a significant reduction in PCB size can be realised. Likewise, the device’s low power consumption (in sleep mode as well as when fully operational) permits a downsizing of the specified battery. All this results in a smaller size and lower weight sensor module. Together with high-g range and fast data acquisition accelerometer, it also represents a step closer to the tire mounted sensor (TMS) implementations that automotive Tier 1 suppliers are looking to use in the future. Best in class precision and low power fast pressure measurements allow extra new features to be implemented like tire filling assistant without a visible impact on battery life. The -40°C to 125°C operational temperature range and strong resilience to shock (10000g) allow the MLX91804 to deal with a harsh in-tire environment.

“Monitoring tire pressure is now an essential part of modern vehicle design,” states Ivan Zagan, Product Manager for TPMS at Melexis. “Global uptake of TPMS is increasing all the time, driven by international regulations and increasing emphasis on the safety of road users. The attributes shown by the MLX91804 will facilitate the next generation of TPMS deployment in automobiles, as it needs just half the board real estate and delivers 3 times lower sleep mode power consumption figures than ICs from rival vendors.” “This cutting-edge device will enable more compact solutions with greater functionality and improved energy efficiency, in line with vehicle manufacturers’ growing expectations. We are pleased to see a growing interest among major players for this technology.” he concludes.

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